Geomechanics Module Updates For users of the Geomechanics Module, COMSOL Multiphysics ® version 5.3a brings three more soil material models and improved default plots, which you can read about in more detail below. Elastoplastic Soil Material Models A new family of soil material models has been added with the new Elastoplastic Soil Material feature in which the elastic and plastic behaviors are not independent. One such material model ( Cam-Clay) existed in previous versions of the COMSOL ® software and it has now been improved and renamed Modified Cam-Clay. The other three materials, commonly used in the geomechanics community, are Hardening Soil, Extended Barcelona Basic, and Modified Structured Cam-Clay. Improved Default Plots The default plots in the structural mechanics physics interfaces have been updated to produce more informative visualizations.

COMSOL Multiphysics® version 5.3 brings geometry performance. Geometry Updates. Where you should select the Show as variant in part library.

The Application Library tutorials have been updated accordingly. In this example, you can see brighter colors in the stress plot (RainbowLight color table), and plastic strain contours and contact pressure contours have been added by default. James A Rehg Rapidshare Files. For comparison, a plot from the default plot in COMSOL Multiphysics ® version 5.3 of the same model is shown. In this example, you can see brighter colors in the stress plot (RainbowLight color table), and plastic strain contours and contact pressure contours have been added by default. For comparison, a plot from the default plot in COMSOL Multiphysics ® version 5.3 of the same model is shown.

RF Module Updates For users of the RF Module, COMSOL Multiphysics ® version 5.3 brings a Part Library for common RF devices, extended options for the Lumped Element boundary condition, and S-parameter calculation for transient simulations. Browse all of the RF Module updates in more detail below. New RF Part Library The RF Module has now introduced a Part Library consisting of a number of standard parts or geometries that assist in modeling RF components that can be included in larger designs of RF devices. Each part has user-controllable parameters and predefined selections that can be manipulated to change geometric configurations, RF device designs, geometry-dependent material properties, and solver settings. The RF parts include: • 36 rectangular waveguides (consisting of straight and 90-degree bend types as well as H-bend types) • 22 surface-mount device footprints • 3 SMA connectors (4 holes, 2 holes, and vertical mount). Two SMA connectors (4 holes and vertical mount) that are connected through a 50-Ohm meander microstrip line.

Two SMA connectors (4 holes and vertical mount) that are connected through a 50-Ohm meander microstrip line. Enhanced Lumped Element Feature with Extended Options The Lumped Element boundary condition has been improved with extra options for the Lumped element device section of its Settings window. Not only can you configure the single-lumped elements — inductor ( L), capacitor ( C), resistor ( R), or complex impedance ( Z) — as device boundary conditions, but also composite elements that involve lumped element parameters, such as series LC, parallel LC, series RLC, or parallel RLC lumped elements. Application Library path for an example using the new lumped element options: RF_Module/Filters/lumped_element_filter Advanced Two-Port Network Modeling with Touchstone File Import A Touchstone file describes the frequency responses of an n-port network circuit in terms of S-parameters. A Touchstone file, obtained from numerical simulations or network analyzer measurements, can be included in COMSOL Multiphysics ® simulations via the Two-Port Network boundary condition without building the complicated shape of the circuit. To do this, select Touchstone file as the Type of S-parameter definition in the Two-Port Network Settings window.

Application Library path for an example using the Touchstone file import feature: RF_Module/Filters/two_port_network_touchstone Surface Magnetic Current Density The new Surface Magnetic Current Density boundary condition has been added to the Electromagnetic Waves, Frequency Domain interface and specifies a surface magnetic current density at both exterior and interior boundaries. Magnetic current density is described by a 3D vector. However, because it flows along a surface, it can be alternatively represented for more efficient modeling. To achieve this, the COMSOL Multiphysics ® software projects this current density onto a boundary surface and neglects its normal component. The new boundary condition has been provided for special modeling situations, such as for modeling electric dipoles. Fast Blog Finder 3 0 2 Cracked there.